Tessera的專利侵案ITC做出最終判決

根據Wall Street Journal的報導：國際貿易委員會(International Trade Commission, ITC)裁定Qualcomm、Motorola、Spansion、STMicroelectronics、Freescale和Advanced Micro Devices旗下的ATI Technologies侵犯了Tessera與特定晶片封裝方式相關的專利權，同時將發佈一項禁止令，禁止進口由上述公司生產或代替上述公司生產的晶片。
本案的裁決結果還有待美國政府審查，審查期限為60天。在此期間，上述晶片可繼續進口，但前提是繳納佔進口額3.5%的保證金。本案的系爭專利為：US6,433,419、US5,852,326。

US6,433,419
Title:Face-up semiconductor chip assemblies
Filing Date:2000.1.20.
Issue Date:2002.8.13.
Abstract:
A semiconductor chip is mounted in face-up disposition, with a contact-bearing front surface facing away from a substrate such as a circuit panel, and with a rear face facing toward the substrate. A backing element having terminals is disposed between the rear face of the chip and the substrate, and the terminals of the backing element are connected to contact pads on the substrate. The terminals of the backing element are movable with respect to the chip to compensate for differential thermal expansion of the chip and substrate.

US5,852,326
Title:Face-up semiconductor chip assembly
Filing Date:1998.7.6.
Issue Date:1998.12.22.
Abstract:
A semiconductor assembly having contacts on a peripheral region of the top surface of a chip and a backing element overlying the bottom surface of the chip. The backing element has terminals such that at least some of the terminals overlie the bottom surface of the chip. Leads including bonding wires extending alongside the edges of the chip connect the contacts and the terminals. The terminals of the assembly are movable with respect to the chip.